HP | HPQ - Modal Pinjaman





Modal Pinjaman Perubahan Tanggal
3D Systems USD 87.24M 454K 2026-06
Accenture USD 5.03B 873K 2026-03
Advanced Micro Devices USD 2.35B 1000K 2026-06
Amphenol USD 17.18B 537.7M 2026-06
Apple USD 71.34B 3.06B 2026-06
Applied Materials USD 5.26B 1.2B 2026-03
Broadcom USD 62.66B 1.15B 2026-03
Canon JPY 404.32B 76M 2026-06
CDW USD 4.81B 173M 2026-06
Ciena USD 1.52B 5.2M 2026-03
Cisco Systems USD 19.37B 2B 2026-03
CommScope USD 7.26B 1.98B 2025-12
Corning USD 7.76B 38M 2026-06
F5 Networks USD 0 0 2024-12
Hewlett Packard USD 18.24B 532M 2026-03
HP USD 8.86B 18M 2026-03
IBM USD 56.21B 1.49B 2026-06
Intel USD 48.55B 5.52B 2026-06
Jabil Circuit USD 2.88B 497M 2026-03
KLA Corporation USD 5.89B 352K 2026-06
Lam Research USD 3.73B 106K 2026-06
Lenovo USD 3.86B 566.95M 2026-03
Micron Technology USD 3.05B 6.51B 2026-03
Microsoft USD 31.07B 356M 2026-06
Motorola Solutions Msi USD 8.42B 2M 2026-06
NCR USD 1.1B 1000K 2026-06
NetApp USD 2.49B 1000K 2026-03
Nvidia USD 7.47B 1000K 2026-03
Oracle USD 122.34B 8.09B 2026-03
Qualcomm USD 12.78B 1.99B 2026-06
Ricoh JPY 348.24B 12.06B 2026-06
Sanmina USD 1.96B 42.45M 2026-06
Seagate Technology USD 3.38B 85M 2026-06
Seiko Epson JPY 165.75B 2.38B 2026-06
Sensata Technologies USD 2.42B 404.6M 2026-06
SYNNEX USD 3.59B 1.16M 2026-03
TE Connectivity USD 5.53B 23M 2026-06
Western Digital USD 2.43B 28M 2025-12
Xerox USD 3.48B 785M 2025-06